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H. U. Akay, Y. Liu, and M. Rassaian, "A Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages," Electronic Packaging Symposium, ASME Annual Meeting, Nov. 11-16, 2001, New York, NY.

H. U. Akay, Gunasekaran Kaliappan, N. H. Paydar, and M. Rassaian, "A Study of Fatigue Life Predictions for PBGA Joints and Comparisions with Test Data", Proceedings of ASME INTERPack '99, June 13-19, 1999, Maui, Hawaii.

H.U.Akay, H.Zhang and N.H.Paydar, "Experimental Correlations of an Energy-Based Fatigue Life Prediction Method for Solder Joints," Proceedings of ASME INTERPack '97, June 15-19, 1997, Island of Hawaii.

H.U. Akay, N. Paydar and A. Bilgic, "Fatigue Life Predictions for Thermally Loaded Solder Joints Using A Volume-Weighted Averaging Technique," ASME Journal of Electronic Packaging, 1997.

H.U. Akay, A. Bilgic and N. Paydar, "Combined Heat Transfer and Thermal Load Analysis for Fatigue Life Prediction of Solder Joints of Resistors", Proceedings of 1997 TMS Annual Meeting on Reliability of Solders and Solder Joints, Feb. 9-13,1997, Orlando, Florida, pp.187-195

H.U. Akay, N Paydar, G.L. Glogas and H. Zhang, "Viscoelastic Study of a Conductive Adhesive for Electronic Packages - Part 1: Experimental Determination of Material Properties", International Journal of Microelectronic Packaging , 1997

H.U. Akay, N. Paydar, H. Zhang and G.L. Glogas, "Viscoelastic Study of a Conductive Adhesive for Electronic Packages - Part 2: Thermal Stress Analysis Using the Finite Element Method", International Journal of Microelectronic Packaging, 1997

H.U. Akay, N. Paydar, G.L. Glogas, H. Zhang and X. Song, "An Experimental and Numerical Study of Viscoelastic Behavior of Conductive Adhesive Joints of Electronic Packages," Final Report Submitted to Naval Air Warfare Center, CAD/CAM Laboratory, Department of Mechanical Engineering, IUPUI, 1996.

N. Paydar, Y. Tong and H.U. Akay, "A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints," ASME Journal of Electronic Packaging, Vol. 116, No. 4, 1995, pp. 265-273.

H.U. Akay, N. Paydar, X. Song and G.L. Glogas, "Viscoelastic Finite Element Analysis of Adhesive Joints Under Thermal Loads," Proceedings of ASME INTERPack '95, March 1995, Lahaina, Hawaii,pp. 775-780.

H.U. Akay, N. Paydar and A. Bilgic, "Experimental Evaluation of Finite Element and Fatigue Life Prediction Methods for Thermally Loaded Solder Joints - Part 1, "Report of CAD/CAM Laboratory, Department of Mechanical Engineering, IUPUI, January 1995.

H.U. Akay, N. Paydar and A. Bilgic, "Experimental Evaluation of Finite Element and Fatigue Life Prediction Methods for Thermally Loaded Solder Joints - Part 2, "Report of CAD/CAM Laboratory, Department of Mechanical Engineering, IUPUI, March 1995.

N. Paydar, Y. Tong and H.U. Akay, "An Investigation of Three-Dimensional Effects in Modeling Solder Joints for Fatigue Life Predictions," Proceedings of the 8th International Microelectronics Conference, 1994, Omiya, Japan, pp. 367-372.

N. Paydar, Y. Tong and H.U. Akay, "A Finite Element Study of Fatigue Life Prediction Methods for Thermally Loaded Solder Joints," Advances in Electronic Packaging, ASME, Book No. 10349B, Edited by P.A. Engel and W.T. Chen, 1993, pp. 1063-1070.

H.U. Akay, Y. Tong and N. Paydar, "Thermal Fatigue Analysis of an SMT Solder Joint Using Nonlinear FEM Approach," International Journal of Microcircuits and Electronic Packaging, Vol. 16, No. 2, 1993, pp. 78-88.

N. Paydar, Y. Tong, H.U. Akay and B. Boehmer, "Finite Element Mesh Generation and Analysis of Solder Joints for Fatigue Life Predictions," Report Submitted to U.S. Army Research Office, Grant No. 29042-MS, IUPUI, August 1993.

H.U. Akay, Y. Tong and N. Paydar, "Thermal Fatigue Analysis of an SMT Solder Joint Using Nonlinear FEM Approach," Proceedings of International Electronic Packaging Conference, 1992, Austin, Texas, pp. 980-998.